It is predicted that the semiconductor fab capacity, which has suffered severe supply for the past two years, will gradually be relaxed in the second half of this year. Pent-ups due to Corona 19 (the phenomenon of suppressed consumption) and inflation (inflation) decreased sales of smartphones, TVs, and PCs, and inventory accumulates, manufacturers canceled chip orders. This is because there is room.
According to market research firm Trend Force on the 8th, the 8-inch fab utilization rate, which has been 100%over the past two years, will decrease to 90-95%in the second half of this year, and the fabs that produce some consumer IT chips will fall below 90%. In addition, the 12-inch fab utilization rate is expected to reach 95%in 2H.
The 8-inch fab is the most insufficient fab in the foundry market. The semiconductor took about 12 to 15 weeks before the order before the shortage. However, as the order was pushed out due to the lack of foundry over the past two years, the semiconductor’s lead time has been more than 30 weeks or more than a year.
The trend force is Power semiconductor (PMIC), CMOS image sensor (CIS), starting with a large driver IC produced in the recent 0.1x micrometers (μM) and 55nm (NM) processes and a touch-display integrated chip (TDDI) produced in the 55nm (NM) process. Certain microcontroller units (MCU) and system-on chips (SOCs) are canceling foundry orders. There is.
The utilization rate of 8-inch nodes (including 0.35 ~ 0.11 μm) is expected to fall the most in the second half of this year. The products produced in this process are driver IC, CIS, and PMIC. Among them, the driver IC was directly affected by the decrease in demand for TV and PC, and the wafer input was the most severe.
Trend Force said, The 8-inch foundry company has begun to feel burdened as the utilization rate of the fab has been reduced due to the cancellation of the customer. I think I’m fighting.
Some chip orders were canceled in the 12-inch process. This year, due to the shrinking the consumer market, smartphone shipments were reduced, and the order volume of the 5G application processor (AP) was lowered.
However, in the high-tech process of 7 nms of 12-inch fabs, production is expected to be maintained except 5G AP. In advanced processes, high-performance chips such as central processing apparatus (CPU), graphic processing apparatus (GPU), on-demand semiconductor (ASIC), programmatic semiconductor (FPGA), and AI accelerator are produced.
The operation rate of 6nm and 7nm process production in the second quarter has fallen slightly from 100%to 95 ~ 99%, and the production of 4nm and 5 nano processes is found to be close to full operation.
Trend Force said, We have expected to lack almost two and a half years of chips by 2023. However, due to the recent low demand for consumer IT products, the foundry wafer utilization rate is relaxing. I think I can be assigned.